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Thermally conductive gel is an advanced thermally conductive material designed to provide efficient heat transfer in electronic devices. It is typically applied as a liquid gap filler that easily fills gaps between irregular surfaces, maximizing heat transfer efficiency. Compared to traditional thermal pastes, thermally conductive gel offers greater workability, requires less pressure to apply, and maintains stable performance across a wide temperature range. This material is widely used in applications requiring efficient heat dissipation, such as processors, semiconductors, and battery management systems. High viscosity thermal gel

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